LTCC for integrated sensor-device applications
2013
Files
Abstract
1. Introduction 2. Structuration techniques 3. Examples - integration 4. Mechanical sensors & reliability 5. Thermal & chemical issues 6. Conclusion & outlook
Details
Title
LTCC for integrated sensor-device applications
Author(s)
Maeder, Thomas ; Farine, Gaël ; Slater, Conor Joseph ; Jiang, Bo ; Vecchio, Fabrizio ; Jacq, Caroline ; Ryser, Peter
Conference
SENSEIVER summer school on LTCC technology for sensor networks, Cracow, Poland, 25.9-4.10.2013
Date
2013
Keywords
couches épaisses; thick-film technology; LTCC; capteurs; sensors; modules intégrés; integrated modules; structuration 3D; 3D structuration; fabrication; lamination; intégration; integration; résistance mécanique; mechanical strength; fatigue statique; static fatigue; stabilité thermique; thermal stability; stabilité chimique; chemical stability; dégradation; degradation; fiabilité; reliability; SENSEIVER
Note
Séminaire ITN SENSEIVER donné après la conférence IMAPS-PL Cracovie Seminar ITN SENSEIVER given after IMAPS-PL Cracow conference
Additional link
URL
Laboratories
LPM
Record Appears in
Scientific production and competences > STI - School of Engineering > STI Archives > LPM - Laboratory of Microengineering for Manufacturing
Presentations & Talks
Work produced at EPFL
Presentations & Talks
Work produced at EPFL
Record creation date
2013-09-27