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conference paper
On-Chip Cooling of Hot-Spots with a Copper Micro-Evaporator
2012
2012 28Th Annual Ieee Semiconductor Thermal Measurement And Management Symposium (Semi-Therm)
Hot-spots are present in micro-electronics and are challenging to cool effectively. Using a copper micro-evaporator mounted on a pseudo-chip, on-chip two-phase cooling was found to very effectively cool the hot-spots without inducing flow instabilities. Building on a flow pattern-based prediction method developed for uniform heat flux conditions, the experimental results could be well predicted.
Use this identifier to reference this record
Type
conference paper
Web of Science ID
WOS:000309172400020
Authors
Publication date
2012
Publisher
Published in
2012 28Th Annual Ieee Semiconductor Thermal Measurement And Management Symposium (Semi-Therm)
ISBN of the book
978-1-4673-1111-3
Publisher place
New York
Total of pages
5
Start page
125
End page
129
Peer reviewed
REVIEWED
EPFL units
Available on Infoscience
February 27, 2013