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conference paper
On-Chip Cooling of Hot-Spots with a Copper Micro-Evaporator
2012
2012 28Th Annual Ieee Semiconductor Thermal Measurement And Management Symposium (Semi-Therm)
Hot-spots are present in micro-electronics and are challenging to cool effectively. Using a copper micro-evaporator mounted on a pseudo-chip, on-chip two-phase cooling was found to very effectively cool the hot-spots without inducing flow instabilities. Building on a flow pattern-based prediction method developed for uniform heat flux conditions, the experimental results could be well predicted.
Type
conference paper
Web of Science ID
WOS:000309172400020
Authors
Publication date
2012
Publisher
Published in
2012 28Th Annual Ieee Semiconductor Thermal Measurement And Management Symposium (Semi-Therm)
ISBN of the book
978-1-4673-1111-3
Publisher place
New York
Total of pages
5
Start page
125
End page
129
Peer reviewed
REVIEWED
EPFL units
Available on Infoscience
February 27, 2013
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