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research article
A Qos-Enabled On-Die Interconnect Fabric For Kilo-Node Chips
2012
To meet rapidly growing performance demands and energy constraints, future chips will likely feature thousands of on-die resources. Existing network-on-chip solutions weren't designed for scalability and will be unable to meet future interconnect demands. A hybrid network-on-chip architecture called Kilo-NoC co-optimizes topology, flow control, and quality of service to achieve significant gains in efficiency.
Type
research article
Web of Science ID
WOS:000304792200004
Authors
Publication date
2012
Published in
Volume
32
Start page
17
End page
25
Peer reviewed
REVIEWED
EPFL units
Available on Infoscience
June 29, 2012
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