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Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via Technology
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Design and Testing Strategies for Modular 3-D-Mult[...]
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Beanato, Giulia
et al
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file(s):
06197726
version 1
06197726.pdf
[2.55 MB]
27 Jan 2018, 13:35
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