3D Integration Technology for Lab-on-a-Chip Applications

A review is presented of advances and challenges in fully integrated systems for personalised medicine applications. One key issue for the commercialisation of such systems is the disposability of the assay-substrate at a low cost. This work adds a new dimension to the integrated circuits technology for lab-on-a-chip systems by employing 3D integration for improved performance and functionality. It is proposed that a disposable biosensing layer can be aligned and temporarily attached to the 3D CMOS stack by the vertical interconnections, and can be replaced after each measurement.


Published in:
Electronics Letters- IEE, 47, 22-24
Year:
2011
Publisher:
Institution of Engineering and Technology
ISSN:
0013-5194
Keywords:
Laboratories:




 Record created 2012-02-28, last modified 2018-09-13


Rate this document:

Rate this document:
1
2
3
 
(Not yet reviewed)