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research article
3D Integration Technology for Lab-on-a-Chip Applications
A review is presented of advances and challenges in fully integrated systems for personalised medicine applications. One key issue for the commercialisation of such systems is the disposability of the assay-substrate at a low cost. This work adds a new dimension to the integrated circuits technology for lab-on-a-chip systems by employing 3D integration for improved performance and functionality. It is proposed that a disposable biosensing layer can be aligned and temporarily attached to the 3D CMOS stack by the vertical interconnections, and can be replaced after each measurement.
Type
research article
Web of Science ID
WOS:000298373000009
Authors
Publication date
2011
Published in
Volume
47
Start page
22
End page
24
Subjects
Peer reviewed
REVIEWED
Available on Infoscience
February 28, 2012
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