Assessement of interfacial layer materials to maximize Thermal Boundary Conductance between copper and diamond
2011
Details
Title
Assessement of interfacial layer materials to maximize Thermal Boundary Conductance between copper and diamond
Author(s)
Monachon, Christian ; Weber, Ludger
Conference
Euromat 2011, Montpellier, France, September 15, 2011
Date
2011
Laboratories
LMM
Record Appears in
Scientific production and competences > STI - School of Engineering > IMX - Institute of Materials > LMM - Mechanical Metallurgy Laboratory
Presentations & Talks
Work produced at EPFL
Published
Presentations & Talks
Work produced at EPFL
Published
Record creation date
2011-10-25