NEMS/CMOS sensor for monitoring deposition rates in stencil lithography

A nanoelectromechanical mass sensor is used to characterize material deposition rates in stencil lithography. The material flux through micron size apertures is mapped with high spatial (below 1 μm) and deposition rate (below 10 pm/s) resolutions by displacing the stencil apertures over the sensor. The sensor is based on a resonating metallic beam (with submicron size width and thickness) monolithically integrated with a CMOS circuit, resulting in a CMOS/NEMS self-oscillator. The sensor is used to test alignment for multi-level nanostencil lithography.


Published in:
Procedia Chemistry, 1, 425-428
Presented at:
Eurosensor XXIII conference, Lausanne, Switzerland, September 6-9, 2009
Year:
2009
Publisher:
Elsevier
Keywords:
Laboratories:




 Record created 2011-07-05, last modified 2018-03-17

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