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conference paper
Climbing robot with thermal glue
2011
Field Robotics: Proceedings of the 14th International Conference on Climbing and Walking Robots and the Support Technologies for Mobile Machines
Climbing robots require an adhesion principle in order to overcome gravity. Many physical principles have been used. In this work, the use of thermal glue is proposed. The implementation of miniature thermal glue dispenser is presented with experimental results. The adhesion force depends on the surface, but 7 N/cm^2 is achieved on aluminium and synthetic surfaces. Several ideas were tested to save energy for detaching the glue foot. A climbing robot using this innovative adhesion principle was built. The strength and disadvantage of this technique are presented. The system offers an alternative solution to other commonly used method.
Type
conference paper
Authors
Editors
Bidaud, Philippe
•
Tokhi, Mohammad O.
•
Grand, Christophe
•
Virk, Gurvinder S.
Publication date
2011
Publisher
Published in
Field Robotics: Proceedings of the 14th International Conference on Climbing and Walking Robots and the Support Technologies for Mobile Machines
ISBN of the book
978-981-4374-27-9
Start page
415
End page
421
Peer reviewed
REVIEWED
EPFL units
Event name | Event place | Event date |
Paris | September 6 – 8, 2011 | |
Available on Infoscience
May 9, 2011
Use this identifier to reference this record