Thermal-Aware System-Level Modeling and Management for Multi-Processor Systems-on-Chip

Multi-Processor Systems-on-Chip (MPSoCs) are penetrating the electronics market as a powerful, yet commercially viable, solution to answer the strong and steadily growing demand for scalable and high performance systems, at limited design complexity. However, it is critical to develop dedicated system-level design methodologies for multi-core architectures that seamlessly address their thermal modeling, analysis and management. In this work, we first formulate the problem of system-level thermal modeling and link it to produce a global thermal management formulation as a discrete-time optimal control problem, which can be solved using finite-horizon model-predictive control (MPC) techniques, while adapting to the actual time-varying unbalanced MPSoC workload requirements. Finally, we compare the system-level MPC-based thermal modeling and management approaches on an industrial 8-core MPSoC design and show their different trade-offs regarding performance while respecting operating temperature bounds.


Published in:
Proceedings of the IEEE International Symposium on Circuits and Systems (ISCAS), 1, 1, 2481-2484
Presented at:
IEEE International Symposium on Circuits and Systems (ISCAS), Rio de Janeiro, Brazil, May 15-18, 2011
Year:
2011
Publisher:
New York, IEEE Press
ISBN:
978-1-4244-9472-9/11
Laboratories:




 Record created 2011-01-25, last modified 2018-03-18

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