The influence of 0-0.1 wt.% Ni on the microstructure and fluidity length of Sn-0.7Cu-xNi

Alloys based on the Sn-0.7Cu-xNi system are potential Pb-free solders. In this paper we report on the solidification characteristics and microstructures of Sn-0.7Cu alloys containing 0-1,000 ppm nickel. The microstructural observations show that increasing the nickel content reduces the volume fraction of primary Sn, thus generating a more-eutectic microstructure. In an attempt to better understand the changes in solderability with Ni additions, fluidity tests were carried out using the Ragone method for small incremental increases in nickel content. The maximum fluidity length was found to vary strongly with nickel content. Additionally, the distribution of nickel within samples was investigated using synchrotron micro X-ray fluorescence.


Published in:
Journal Of Electronic Materials, 37, 1, 32-39
Presented at:
Symposium on Pb-Free Electronic Solders held at the 2007 TMS Annual Meeting, Orlando, FL, 2007
Year:
2008
Publisher:
Springer Verlag
ISSN:
0361-5235
Keywords:
Laboratories:




 Record created 2010-11-30, last modified 2018-03-17

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