Techniques for fully integrated intra-/inter-chip optical communication

In this paper we propose to replace all data and control pads generally present in conventional chips with a new type of ultra-compact, low-power optical interconnect implemented almost entirely in CMOS. The proposed scheme enables optical through-chip buses that could service hundreds of thinned stacked dies. High throughputs and communication density could be achieved even in tight power budgets. The core of the optical interconnect is a single-photon avalanche diode operating in pulse position modulation. We demonstrate how throughputs of several gigabits per second may be achieved. We also show a systematic analysis of the system and preliminary results to support its suitability in emerging DSM technologies.

Published in:
2008 45Th Acm/Ieee Design Automation Conference, Vols 1 And 2, 343-344
Presented at:
45th ACM/IEEE Design Automation Conference, Anaheim, CA, Jun 08-13, 2008
Ieee Service Center, 445 Hoes Lane, Po Box 1331, Piscataway, Nj 08855-1331 Usa

 Record created 2010-11-30, last modified 2018-03-17

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