Direct writing laser of high aspect ratio epoxy microstructures

The development of high aspect ratio (AR) structures is of great interest in several fields such as micro-electro-mechanical systems or microfluidics. In this note we present a new processing method of epoxy materials based on direct write laser (DWL) scanning exposure. In this work, we describe the application of this technique for fast prototyping, and the cost-efficient fabrication of structures with a high AR over 40. Such properties demonstrate the proposed DWL of epoxy materials as a promising candidate for the development of polymer-based microsystems.


Published in:
Journal of Micromechanics and Microengineering, 21, 1, 017003
Year:
2010
Publisher:
Institute of Physics
ISSN:
1361-6439
Keywords:
Laboratories:


Note: The status of this file is: EPFL only


 Record created 2010-11-25, last modified 2018-01-28

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