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conference poster not in proceedings
Low Temperature Indium-based Sealing of Microfabricated Alkali Cells for Chip Scale Atomic Clocks
2010
In this paper, the development of a low temperature bonding process focused on indium-based technology for microfabricated alkali cells is presented. The intended application is the use of these cells in chip scale atomic clocks. The existing technology is mainly based on anodic bonding. For some applications, such as where wall coating is used instead of buffer gas, anodic bonding cannot be applied because of the relatively high temperature of the process.
Type
conference poster not in proceedings
Authors
Publication date
2010
EPFL units
Event name | Event place | Event date |
Noordwijk, Netherlands | April 13-16, 2010 | |
Available on Infoscience
November 5, 2010
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