Thermal modeling and analysis of 3D multi-processor chips

As 3D chip multi-processors (3D-CMPs) become the main trend in processor development, various thermal management strategies have been recently proposed to optimize system performance while controlling the temperature of the system to stay below a threshold. These thermal-aware policies require the envision of high-level models that capture the complex thermal behavior of (nano)structures that build the 3D stack. Moreover, the floorplanning of the chip strongly determines the thermal profile of the system and a quick exploration of the design space is required to minimize the damage of the thermal effects.


Published in:
Integration -Amsterdam-, 43, 7, 1-15
Year:
2010
Publisher:
Elsevier
ISSN:
0167-9260
Keywords:
Laboratories:




 Record created 2010-07-26, last modified 2018-03-17

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