Emulation-Based Transient Thermal Modeling of 2D/3D Systems-on-Chip with Active Cooling

New tendencies envisage 2D and 3D Multi-Processor Systems-On-Chip (MPSoCs) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute multiple applications (games, video), while meeting additional design constraints (energy consumption, time-to-market, etc.). Moreover, the rise of temperature in the die for MPSoCs, especially for forthcoming 3D chips, can seriously affect their final performance and reliability. In this context, transient thermal modeling is a key challenge to study the accelerated thermal problems of MPSoC designs, as well as to validate the benefits of active cooling techniques (e.g., liquid cooling), combined with other state-of-the-art methods (e.g., dynamic frequency and voltage scaling), as a solution to overcome run-time thermal runaway. In this paper, we present a novel approach for fast transient thermal modeling and analysis of 2D/3D MPSoCs with active cooling, which relies on the exploitation of combined hardwaresoftware emulation. The proposed framework uses FPGA emulation as the key element to model the hardware components of 2D/3D MPSoC platforms at multi-megahertz speeds, while running real-life software multimedia applications. This framework automatically extracts detailed system statistics that are used as input to a scalable software thermal library, using different ordinary differential equation solvers, running in a host computer. This library calculates at run-time the temperature of on-chip components, based on the collected statistics from the emulated system and the final floorplan of the 2D/3D MPSoC. This approach creates a closeloop thermal emulation system that allows MPSoC designers to validate different hardware- and software-based thermal management approaches, including liquid cooling injection control, under transient and dynamic thermal maps. The experimental results with 2D/3D MPSoCs, based on the UltraSPARC T1 and other industrial platforms from Freescale, illustrate speed-ups of more than three orders of magnitude compared to cycle-accurate MPSoC thermal simulators.

Published in:
Proceedings of the 15th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2009), 1, 1, 1-3
Presented at:
15th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2009), Leuven, October 7-9, 2009
New York, IEEE Press

 Record created 2009-08-16, last modified 2018-03-17

Download fulltextPDF
External link:
Download fulltextURL
Rate this document:

Rate this document:
(Not yet reviewed)