Loading...
conference paper
Silicon Liquid Flow Sensor Encapsulation using Metal to Glass Anodic Bonding
2004
MEMS 2004
Type
conference paper
Authors
Publication date
2004
Published in
MEMS 2004
Volume
1
Start page
649
End page
652
Peer reviewed
NON-REVIEWED
EPFL units
Available on Infoscience
May 12, 2009
Use this identifier to reference this record