Measurement of the Bending Strength of Vapor-Liquid-Solid Grown Silicon Nanowires

The fracture strength of silicon nanowires grown on a [111] silicon substrate by the vapor-liquid-solid process was measured. The nanowires, with diameters between 100 and 200 nm and a typical length of 2 μm, were subjected to bending tests using an atomic force microscopy setup inside a scanning electron microscope. The average strength calculated from the maximum nanowire deflection before fracture was around 12 GPa, which is 6% of the Young's modulus of silicon along the nanowire direction. This value is close to the theoretical fracture strength, which indicates that surface or volume defects, if present, play only a minor role in fracture initiation. © 2006 American Chemical Society.


Published in:
Nano Letters, 6, No.4, 4, 622-625
Year:
2006
ISSN:
15306984
Note:
IMT-NE Number: 433
Laboratories:




 Record created 2009-02-10, last modified 2018-03-17

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