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conference paper
Solder-filling of a CIC cable for the EFDA dipole magnet
2008
Advances in Cryogenic Engineering Materials, ICMC
Type
conference paper
Authors
Publication date
2008
Published in
Advances in Cryogenic Engineering Materials, ICMC
ISBN of the book
978-0-7354-0505-9
Series title/Series vol.
AIP Conference Proceedings; 986
Volume
54
Start page
151
End page
158
Subjects
Peer reviewed
REVIEWED
Event name | Event place | Event date |
Chattanooga (Tennessee) | 16–20 July 2007 | |
Available on Infoscience
December 2, 2008
Use this identifier to reference this record