Exploring Temperature-Aware Design of Memory Architectures in VLIW Systems

This paper presents a thermal model to analyze the temperature evolution in the shared register files found on VLIW systems. The use of this model allows the analysis of several factors that have an strong impact on the heat transfer: layout topology, placement and memory accesses. Finally, some relevant conclusions are obtained after analyzing the thermal behavior of several multimedia applications.


Published in:
Proceedings of the International Workshop on Innovative Architecture for Future Generation High-Performance Processors and Systems , 1, 1, 81-88
Presented at:
International Workshop on Innovative Architecture for Future Generation High-Performance Processors and Systems 2007, Mauii, January 24-25, 2007
Year:
2007
Publisher:
New York, IEEE Computer Society
Keywords:
Laboratories:




 Record created 2008-11-21, last modified 2018-09-13

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