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conference paper
Retest of the TFAS1 sample with solder filled extremities
2007
IEEE Transactions on Applied Superconductivity
Type
conference paper
Web of Science ID
WOS:000256625700240
Authors
•
•
•
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Vogel, M.
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Ciaxynski, D.
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Martoveski, N.
Publication date
2007
Published in
IEEE Transactions on Applied Superconductivity
Volume
18
Issue
2
Start page
1080
End page
1083
Peer reviewed
REVIEWED
Event name | Event place | Event date |
Philadelphia, Penn, USA | 2007-08-27 | |
Available on Infoscience
May 13, 2008
Use this identifier to reference this record