Tensile properties and microstructure of Danocrystalline electrodeposited Ni at temperatures between room temperature and 330° C are presented. Above 300° C low flow stress and high tensile elongation are observed along with grain growth and segregation of sulphur to the grain boundaries causing the formation of a Ni-sulphide phase. © 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.