The field of micro electromechanical systems (MEMS) evolved from the microelectronic industry and the technologies developed to fabricate integrated circuits. As a result, MEMS are commonly fabricated on silicon wafers. The development of MEMS has been driven by three main merits: miniaturisation, microelectronics integration, and parallel fabrication with high precision. Many operational properties scale well with smaller sizes. In addition, integrated electronic circuitry allows embedding MEMS with computing or networking capabilities, while parallel manufacturing enables the fabrication of many identical devices on a single wafer, reducing the unit cost. The main MEMS application is transducers which transform signals from one form of energy to another, and can be used for perception (sensors) or to produce actions (actuators). Silicon and other microelectronic materials like metals have enabled very high-performance MEMS transducers because these materials can be used for a range of very effective actuating and sensing principles. More recently, polymers have started to be used in MEMS because of their unique electrical, physical and chemical properties which include biocompatibility, viscoelasticity and mechanical shock tolerance. They are also much softer than silicon or metals, and they can be processed using many techniques that allow unique low-cost, batch-style fabrication and packaging. However, polymers have relatively low glass-transition and melting temperatures. As a result, the advantages of polymers cannot easily be combined with high-performance actuating and sensing elements as these are based on silicon technology and require high-temperature fabrication steps. Here, a hybrid-MEMS fabrication process is used to address this issue. The developed devices are based on a trilayer structure, where a thick polymer core is sandwiched between two hard thin films, while electronic layers are embedded within in a fluid-compatible way. The objective of this thesis is to turn hybrid-MEMS into a benchmark MEMS technology. This involves many different aspects. First, sensing and actuation elements are integrated into trilayer devices, and their performance is analysed. Then, some more unique possibilities offered by hybrid-MEMS are exploited. A way to fabricate electronics on multiple layers is developed, which allows different electronic features to be integrated in parallel. In addition, three-dimensional bulk features fabricated at several levels are demonstrated. This is possible because the hybrid-MEMS process is based on the bonding of multiple wafers. All these new fabrication features are demonstrated in atomic force microscopy (AFM) applications. Self-actuated trilayer AFM cantilevers with sharp silicon tips are used to boost imaging speeds in the off-resonance tapping (ORT) mode, thanks to an order of magnitude faster surface probing rates. Furthermore, fully integrated ORT imaging is demonstrated with self-actuated piezoresistive cantilevers. Next, trilayer cantilevers with shielded conductive tips are introduced for electrical AFM modes. Finally, ongoing research projects are touched upon, including approaches to fabricate hybrid-MEMS with single crystal silicon piezoresistors for improved sensitivity, and an analysis of reproducibility of fabricated trilayer cantilevers.