Driven by the performance demands of microprocessors and power chips, there is a growing trend to increase the number of transistors and chip area in integrated circuit designs. Consequently, the thermal design power (TDP) of chips increases, necessitating efficient heat dissipation to ensure chip performance and reliability. In this study, a lotus leaf-inspired manifold ring-shaped channel cold plate was designed to cool high-power chips, inspired by the fluid pathways in lotus leaves. The heat sink was fabricated from copper through numerical topology optimization and was then assembled using silver sintering. The transitions in flow patterns and heat transfer mechanisms within the new heat sink design are observed and reported for the first time. The flow patterns in the manifold region can be categorized as bubbly flow, slug flow, annular flow, pulsating-annular flow, and mist flow. Pulsating-annular flow exhibits the highest pressure drop and mass flow rate fluctuations, significantly enhancing the heat transfer coefficient. The average heat transfer coefficient, critical heat flux, and COP of the new heat sink design are up to 2.13 W/(cm2·K), 267.05 W/cm2, and 18,906, with a hydraulic diameter of 0.466 mm. Compared to traditional large-area chip parallel microchannel heat sink designs, the experimental results indicate that the new design enhances the heat transfer coefficient, critical heat flux, and COP by up to 56.32 %, 1728.28 %, and 472.65 %, respectively, at a similar mass flow rate, despite its a larger hydraulic diameter. The new design can dissipate up to 801 W of heating power and, for the first time, achieve an effective heat flux dissipation of 267 W/cm2 using HFE-7100 for large-area chips. This research could provide a valuable reference for the design and thermal management of large-area chips and packaging.