conference paper
Cryogenic sEKV Compact Model Applied to 22 NM FDSOI Enabling Low-Temperature Circuit Simulation
March 9, 2025
2025 9th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
Type
conference paper
Author(s)
École Polytechnique Fédérale de Lausanne
École Polytechnique Fédérale de Lausanne
École Polytechnique Fédérale de Lausanne
École Polytechnique Fédérale de Lausanne
École Polytechnique Fédérale de Lausanne
Date Issued
2025-03-09
Publisher
Published in
2025 9th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
Start page
1
End page
3
Editorial or Peer reviewed
REVIEWED
Written at
EPFL
| Event name | Event acronym | Event place | Event date |
Hong Kong, Hong Kong | 2025-03-09 - 2025-03-12 | ||
Available on Infoscience
July 2, 2025
Use this identifier to reference this record