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  4. In-depth Cryogenic Characterization of 22 nm FDSOI Technology for Quantum Computation
 
conference paper

In-depth Cryogenic Characterization of 22 nm FDSOI Technology for Quantum Computation

Han, Hung-Chi  
•
Jazaeri, Farzan  
•
D'Amico, Antonio  
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September 1, 2021
2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS)
7th Joint International EuroSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS'2021)

In this paper, the influence of temperature and back-gate bias is experimentally investigated on 22 nm FDSOI CMOS process. Cryogenic DC characterization was carried out under various back-gate voltages, V back , from 2.95 K back to 300 K. An abrupt drop-off in drain current due to intersubband scattering is experienced in the transfer characteristic with a certain V back . Moreover, resonant and source-to-drain tunneling transports are observed in devices with minimal channel length at cryogenic temperatures. The threshold voltage, V T , and free carrier mobility, µ eff , and their dependence on the back-gate voltage over a wide range of temperatures are extracted and discussed in detail. This work aims at investigating the impact of back gate potential on V T and carrier transport at cryogenic temperatures, further paving the way towards up-scaling of quantum computers.

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In-depth_Cryogenic_Characterization_of_22_nm_FDSOI_Technology_for_Quantum_Computation.pdf

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