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research article

Global modeling strategy of parasitic coupled currents induced by minority-carrier propagation in semiconductor substrates

Lo Conte, F.  
•
Sallese, Jean-Michel  
•
Pastre, M.  
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2010
IEEE Transactions on Electron Devices

This paper presents a modeling strategy to simulate the propagation of electrical perturbations induced by direct biasing of substrate junctions. Usually, this is done by identifying parasitic substrate devices such as bipolar transistors. However, mapping a topology with these bipolar transistors rapidly reaches its limits when several junctions are acting at the same time. In this paper, we propose a new modeling methodology of parasitic signals. It relies on a generalized model of p-n junctions and resistances that takes into account minority-carrier densities and gradients at the boundaries. We show that bipolar-transistor- and thyristor-related effects can be obtained from a network interconnection of these extended devices. Furthermore, we show that this modeling approach could be easily extended to simulate complex 3-D layouts. © 2009 IEEE.

  • Details
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Type
research article
DOI
10.1109/TED.2009.2035025
Web of Science ID

WOS:000273088600032

Scopus ID

2-s2.0-73349135917

Author(s)
Lo Conte, F.  
Sallese, Jean-Michel  
Pastre, M.  
Krummenacher, F.  
Kayal, M.  
Date Issued

2010

Published in
IEEE Transactions on Electron Devices
Volume

57

Issue

1

Start page

263

End page

272

Subjects

Integrated circuit (IC)

•

Lumped modeling

•

Methodology modeling

•

Noise

•

Parasitic coupling

•

Power parasitic modeling

•

Power semiconductor devices

•

Smart Power IC

•

Substrate modeling

Note

Ecole Polytechnique Fédérale de Lausanne, 1015 Laussane, Switzerland

Export Date: 19 January 2010

Source: Scopus

Art. No.: 5339188

References: Murari, B., Bertotti, F., Vignola, G., (2002) Smart Power ICs, pp. 218-220. , 2nd ed. Berlin, Germany: Springer-Verlag; Clement, F.J.R., Zysman, E., Kayal, M., Declercq, M., LAYIN: Toward a global solution for parasitic coupling modeling and visualization (1994) Proc. IEEE Custom Integr. Circuits Conf., pp. 537-540; Birrer, P., Fiez, T.S., Mayaram, K., Silencer!: A tool for substrate noise coupling analysis (2004) Proc. IEEE SOC Conf., pp. 105-108; (2009) Coupling Wave Solutions (CWS), , http://www.cwseda.com/, accessed January. [Online]. Available; Schenkel, M., (2003) Substrate Current Effects in Smart Power ICs, , Konstanz, Germany: Hartung-Gorre-Verlag; Casalta, J.M., Aragons, X., Rubio, A., Substrate coupling evaluation in BiCMOS technology (1997) IEEE J. Solid-State Circuits, 32 (4), pp. 568-603. , Apr; Kayal, M., Saez, R.L., Pastre, M., The reduction of switching noise using CMOS current steering logic (2003) Substrate Noise Coupling in Mixed-Signal ASICs, pp. 223-228. , Norwell, MA: Kluwer; Oehmen, J., Olbrich, M., Hedrich, L., Barke, E., Modeling lateral parasitic transistors in smart power ICs (2006) IEEE Trans. Device Mater. Rel., 6 (3), pp. 408-420. , Sep; Lo Conte, F., Pastre, M., Sallese, J.M., Krummenacher, F., Kayal, M., Substrate current modeling for high-voltage smart power BCD technology (2008) IEEE NEWCAST-TAISA, pp. 141-144. , Jun; Neamen, D.A., (1992) Semiconductor Physics and Devices, , Homewood IL: Irwin; Sze, S.M., (1981) Physics of Semiconductor Device, , 2nd ed. Hoboken, NJ: Wiley; (2009) Cadence Virtuoso Multi-Mode Simulation, , http://www.cadence.com/rl/Resources/datasheets/virtuoso-mmsim.pdf, accessed on Jan. [Online]. Available; (2009) Sentaurus Device Datasheet, , http://www.synopsys.com/Tools/TCAD/CapsuleModule/sdevice-ds.pdf, accessed on Jan. [Online]. Available; Gray, P.R., Meyer, R.G., (1977) Analysis and Design of Analog Integrated Circuits, , Hoboken, NJ: Wiley

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Available on Infoscience
October 21, 2010
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/55934
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