conference paper not in proceedings
Tungsten Through Silicon Vias for 3D high quality factor embedded RF MEMS inductors
2013
Type
conference paper not in proceedings
Author(s)
Fernández-Bolaños Badía, Montserrat
Wieland, Robert
Weber, Josef
Klumpp, Armin
Ramm, Peter
Date Issued
2013
Editorial or Peer reviewed
REVIEWED
Written at
EPFL
EPFL units
| Event name | Event place | Event date |
London, UK | September 16-19, 2013 | |
Available on Infoscience
November 4, 2013
Use this identifier to reference this record