conference paper not in proceedings
Analysis of electromigration voiding phenomena in Cu interconnects
2006
Type
conference paper not in proceedings
Author(s)
Arnaud, L.
Guillaumond, J.F.
Claret, N.
Guedj, C.
Dupeux, M.
Arnal, V.
Reimbold, G.
Passemard, G.
Torres, J.
Date Issued
2006
Editorial or Peer reviewed
REVIEWED
Written at
OTHER
EPFL units
| Event name | Event date |
2006 | |
Available on Infoscience
November 14, 2014
Use this identifier to reference this record