Bulk PZT ceramics provide high electromechanical coupling (k) which is desirable for piezoelectric energy harvesters since the energy transformed from a mechanical agitation into an electrical output is proportional to k2 [1-2]. However, piezoelectric cantilever-based energy harvesters using bulk PZT require a bonding layer to couple the thick PZT sheet to the elastic layer substrate, typically silicon. We present the characteristics and performance of vibration energy harvesters comparing three different bonding interfaces: a UV cured glue (Delo 4552), BiSn soldering, and a dry foil laminated photoresist. The later is demonstrated to be advantageous as it can be easily patterned with photolithography, it has a well defined thickness, and it provides good adhesion to a variety of substrate materials (metal, glass, silicon, and plastic).