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  4. Foundry compatible, efficient wafer-scale manufacturing of ultra-low loss, high-density Si<inf>3</inf>N<inf>4</inf> photonic integrated circuits
 
conference paper

Foundry compatible, efficient wafer-scale manufacturing of ultra-low loss, high-density Si3N4 photonic integrated circuits

Ji, Xinru  
•
Wang, Rui Ning  
•
Liu, Yang
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2024
Optical Fiber Communication Conference in Proceedings Optical Fiber Communication Conference, OFC 2024
Optical Fiber Communication Conference

We demonstrate ultra-low propagation loss, lithographic precision, and wafer-scale manufacturing for high-density Si3N4 photonic integrated circuits using an efficient DUV-based subtractive approach. We show a propagation loss as low as 1.4 dB/m at 1.55 µm.

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Type
conference paper
DOI
10.1364/ofc.2024.tu2b.3
Scopus ID

2-s2.0-85211694436

Author(s)
Ji, Xinru  

École Polytechnique Fédérale de Lausanne

Wang, Rui Ning  

École Polytechnique Fédérale de Lausanne

Liu, Yang

École Polytechnique Fédérale de Lausanne

Riemensberger, Johann  

École Polytechnique Fédérale de Lausanne

Qiu, Zheru  

École Polytechnique Fédérale de Lausanne

Kippenberg, Tobias J.  

École Polytechnique Fédérale de Lausanne

Date Issued

2024

Publisher

Optical Society of America

Published in
Optical Fiber Communication Conference in Proceedings Optical Fiber Communication Conference, OFC 2024
ISBN of the book

9781957171326

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
LPQM1  
LPQM2  
Event nameEvent acronymEvent placeEvent date
Optical Fiber Communication Conference

San Diego, United States

2024-03-24 - 2024-03-28

FunderFunding(s)Grant NumberGrant URL

EPFL center of MicroNanoTechnology

Air Force Office of Scientific Research

FA9550-19-1-0250

EU H2020 research and innovation program

101017237,101047289,965124

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Available on Infoscience
January 26, 2025
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/245059
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