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  4. General Thermosyphon Simulation Code for Electronics Cooling Applications
 
conference paper

General Thermosyphon Simulation Code for Electronics Cooling Applications

Marcinichen, Jackson B.
•
Amalfi, Raffaele L.
•
Cataldo, Filippo  
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January 1, 2020
Proceedings Of The Nineteenth Intersociety Conference On Thermal And Thermomechanical Phenomena In Electronic Systems (Itherm 2020)
19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Two-phase micro-scale cooling implemented with passive, gravity-driven closed-loop thermosyphons represents a highly-reliable solution to increase heat dissipation and to maximize energy efficiency of the next-generation electronics cooling technologies. The current paper presents an updated description of the general simulation software presented at ITHERM 2017, which is able to analyze and design thermosyphon-based cooling systems with high accuracy. In particular, the present simulator is mainly composed of two nested sub-routines: (i) an internal routine that incorporates the best literature methods to evaluate local flow boiling and local condensation heat transfer coefficients and pressure drops in micro-scale evaporator cold plates (at the heat source location) and condensers (at the heat rejection location); and (ii) an external routine that includes the methods to simulate all components of a thermosyphon (condenser, riser, downcomer, evaporator and, optionally, liquid accumulator) with their operational characteristics and thermal performance. In addition, a new extensive experimental validation of the thermosyphon code is performed, in which the simulation results are compared against a comprehensive thermosyphon database, including several types of micro-scale evaporators, different types of condensers (air-cooled and liquid-cooled), various riser/downcomer diameters, a range of thermosyphon heights and numerous refrigerants as working fluids. In fact, the thermosyphon simulator has been validated over a wide range of thermosyphon sizes, going from the smallest height of 15 cm for server cooling applications up to the largest height of 50 cm to cool high-power telecommunications electronics. Finally, the paper discusses the effects of different parameters on the thermosyphon thermal-hydraulic performance, such as working fluid, riser/downcomer diameters, secondary side coolant inlet temperature and mass flow rates, filling ratio and heat load in order to give guidelines and recommendations for an accurate and robust system design.

  • Details
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Type
conference paper
DOI
10.1109/ITherm45881.2020.9190310
Web of Science ID

WOS:000701365300053

Author(s)
Marcinichen, Jackson B.
Amalfi, Raffaele L.
Cataldo, Filippo  
Thome, John R.  
Date Issued

2020-01-01

Publisher

IEEE

Publisher place

New York

Published in
Proceedings Of The Nineteenth Intersociety Conference On Thermal And Thermomechanical Phenomena In Electronic Systems (Itherm 2020)
ISBN of the book

978-1-7281-9764-7

Start page

389

End page

395

Subjects

Thermodynamics

•

Engineering, Electrical & Electronic

•

Engineering, Mechanical

•

Engineering

•

electronics cooling

•

micro-scale heat transfer

•

modeling

•

passive cooling technologies

•

thermosyphon

•

two-phase flow simulations

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
LTCM  
Event nameEvent placeEvent date
19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

ELECTR NETWORK

Jul 21-23, 2020

Available on Infoscience
November 6, 2021
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/182788
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