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  4. Implementation of Passive Two-Phase Cooling to an Entire Server Rack
 
conference paper

Implementation of Passive Two-Phase Cooling to an Entire Server Rack

Cataldo, Filippo  
•
Amalfi, Raffaele L.
•
Marcinichen, Jackson B.
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January 1, 2020
Proceedings Of The Nineteenth Intersociety Conference On Thermal And Thermomechanical Phenomena In Electronic Systems (Itherm 2020)
19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

As data centers grow exponentially in size and number worldwide, it appears evident that more efficient and reliable cooling solutions are needed to reduce energy consumption and noise level significantly. Thermosyphon-based systems have been proven to respect both these goals, and their inherent natural circulation makes them very attractive for heat rejection of individual servers and entire server racks. In this study, the thermosyphon concept is applied as a retrofit cooling system on an actual server rack. The cooling system is composed of two stages: (i) server-level thermosyphons for the direct cooling of the two Central Processing Units (CPUs) and (ii) a rack-level thermosyphon for the cooling of the condenser side of the server-level thermosyphons. Nearly zero-Global Warming Potential (GWP) refrigerants, R1234ze(E) and R1234yf, are used as the working test fluids for the server-level thermosyphons, while for now R1234ze(E) is the only fluid used for the rack-level thermosyphon. A server-level thermosyphon is first tested when cooled directly by water at 20 degrees C, without a rack-level thermosyphon, to define its thermal performance. Then, the rack-level thermosyphon is installed in such a way that it serves the subcooled liquid at the server-level thermosyphons in a parallel configuration. The condenser of the rack-level thermosyphon is cooled by water entering at 20 degrees C.

Experimental results show that the maximum CPU's temperatures are stable at about 40 - 45 degrees C when they work at their maximum load, which is 25 to 40 K less than the commercial air-cooling solution before the conversion from air to thermosyphon cooling. Fan power consumption is reduced by 100 W, and the rack-thermosyphon conveys all the heat rejected directly to the chilled water, requiring no additional pumps or fans. This demonstrator and its results show the potential of thermosyphon cooling technology to achieve higher system performance. In particular, highly performing CPUs can be safely used in data centers as there is not the heat transfer limitation of air-cooling. The proposed approach would allow significant efficiencies to be made in the facility air-handling systems, ultimately leading to operational cost savings. In addition, maintenance is reduced significantly as no moving parts are required for gravity-driven thermosyphon. The heat rejection occurs directly to the chilled water, without the need to pass through air handlers and coils, reducing the mean temperature difference and increasing the Coefficient of Performance (COP) of the chiller significantly (the COP can increase by a factor of 2 to 5, depending on the cases).

  • Details
  • Metrics
Type
conference paper
DOI
10.1109/ITherm45881.2020.9190327
Web of Science ID

WOS:000701365300054

Author(s)
Cataldo, Filippo  
Amalfi, Raffaele L.
Marcinichen, Jackson B.
Thome, John R.  
Date Issued

2020-01-01

Publisher

IEEE

Publisher place

New York

Published in
Proceedings Of The Nineteenth Intersociety Conference On Thermal And Thermomechanical Phenomena In Electronic Systems (Itherm 2020)
ISBN of the book

978-1-7281-9764-7

Start page

396

End page

401

Subjects

Thermodynamics

•

Engineering, Electrical & Electronic

•

Engineering, Mechanical

•

Engineering

•

data center cooling

•

rack

•

refrigerant

•

server

•

thermosyphon

•

two-phase

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
LTCM  
Event nameEvent placeEvent date
19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

ELECTR NETWORK

Jul 21-23, 2020

Available on Infoscience
November 6, 2021
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/182809
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