Repository logo

Infoscience

  • English
  • French
Log In
Logo EPFL, École polytechnique fédérale de Lausanne

Infoscience

  • English
  • French
Log In
  1. Home
  2. Academic and Research Output
  3. Conferences, Workshops, Symposiums, and Seminars
  4. A 256x256 45/65nm 3D-Stacked SPAD-Based Direct TOF Image Sensor for LiDAR Applications with Optical Polar Modulation for up to 18.6dB Interference Suppression
 
Loading...
Thumbnail Image
conference paper

A 256x256 45/65nm 3D-Stacked SPAD-Based Direct TOF Image Sensor for LiDAR Applications with Optical Polar Modulation for up to 18.6dB Interference Suppression

Ximenes, Augusto Ronchini  
•
Padmanabhan, Preethi  
•
Lee, Myung-Jae  
Show more
January 1, 2018
2018 Ieee International Solid-State Circuits Conference - (Isscc)
65th IEEE International Solid-State Circuits Conference (ISSCC)

Light detection and ranging (LiDAR) systems based on direct time-of-flight (DTOF) are used in spacecraft navigation, assembly-line robotics, augmented and virtual reality (AR/VR), (drone-based) surveillance, advanced driver assistance systems (ADAS), and autonomous cars. Common requirements are accuracy and speed, while ensuring long operating distance, high tolerance to background illumination and robustness to interference from other LiDAR systems. To meet these demands, the DTOF sensor community has provided numerous architectures, typically making use of resource sharing that often introduces tradeoffs between pixel count and speed. If resource sharing is not used, reduced fill factor, high non-uniformity, and pile-up distortion generally arise, thus limiting overall performance [1].

  • Details
  • Metrics
Type
conference paper
DOI
10.1109/ISSCC.2018.8310201
Web of Science ID

WOS:000459205600033

Author(s)
Ximenes, Augusto Ronchini  
•
Padmanabhan, Preethi  
•
Lee, Myung-Jae  
•
Yamashita, Yuichiro
•
Yaung, D. N.
•
Charbon, Edoardo  
Date Issued

2018-01-01

Publisher

IEEE

Publisher place

New York

Journal
2018 Ieee International Solid-State Circuits Conference - (Isscc)
ISBN of the book

978-1-5090-4940-0

Series title/Series vol.

IEEE International Solid State Circuits Conference

Start page

96

End page

98

Subjects

Engineering, Electrical & Electronic

•

Engineering

Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
AQUA  
Event nameEvent placeEvent date
65th IEEE International Solid-State Circuits Conference (ISSCC)

San Francisco, CA

Feb 11-15, 2018

Available on Infoscience
June 18, 2019
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/157504
Logo EPFL, École polytechnique fédérale de Lausanne
  • Contact
  • infoscience@epfl.ch

  • Follow us on Facebook
  • Follow us on Instagram
  • Follow us on LinkedIn
  • Follow us on X
  • Follow us on Youtube
AccessibilityLegal noticePrivacy policyCookie settingsEnd User AgreementGet helpFeedback

Infoscience is a service managed and provided by the Library and IT Services of EPFL. © EPFL, tous droits réservés