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  4. Growth kinetics of Al-Fe intermetallic compounds during annealing treatment of friction stir lap welds
 
research article

Growth kinetics of Al-Fe intermetallic compounds during annealing treatment of friction stir lap welds

Movahedi, M.
•
Kokabi, A. H.
•
Reihani, S. M. Seyed
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2014
Materials Characterization

In this study, we explored the growth kinetics of the Al-Fe intermetallic (IM) layer at the joint interface of the St-12/Al-5083 friction stir lap welds during post-weld annealing treatment at 350, 400 and 450 degrees C for 30 to 180 mm. Optical microscope (OM), field emission gun scanning electron microscope (FEG-SEM) and transmission electron microscope (TEM) were employed to investigate the structure of the weld zone. The thickness and composition of the IM layers were evaluated using image analysis system and electron back-scatter diffraction (EBSD), respectively. Moreover, kernel average misorientation (KAM) analysis was performed to evaluate the level of stored energy in the as-welded state. The results showed that the growth kinetics of the IM layer was not governed by a parabolic diffusion law. Presence of the IM compounds as well as high stored energy near the joint interface of the as-welded sample was recognized to be the origin of the observed deviation from the parabolic diffusion law. (c) 2014 Elsevier Inc. All rights reserved.

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Type
research article
DOI
10.1016/j.matchar.2014.01.023
Web of Science ID

WOS:000334142000014

Author(s)
Movahedi, M.
Kokabi, A. H.
Reihani, S. M. Seyed
Najafi, H.  
Farzadfar, S. A.
Cheng, W. J.
Wang, C. J.
Date Issued

2014

Publisher

Elsevier Science Inc

Published in
Materials Characterization
Volume

90

Start page

121

End page

126

Subjects

Friction stir welding

•

Annealing

•

Intermetallics

•

Diffusion

•

Transmission electron microscopy

•

Kernel average misorientation

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
ICMP  
Available on Infoscience
May 19, 2014
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/103463
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