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research article

3D Integration Technology for Lab-on-a-Chip Applications

Temiz, Yuksel  
•
Kilchenmann, Samuel  
•
Leblebici, Yusuf  
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2011
Electronics Letters- IEE

A review is presented of advances and challenges in fully integrated systems for personalised medicine applications. One key issue for the commercialisation of such systems is the disposability of the assay-substrate at a low cost. This work adds a new dimension to the integrated circuits technology for lab-on-a-chip systems by employing 3D integration for improved performance and functionality. It is proposed that a disposable biosensing layer can be aligned and temporarily attached to the 3D CMOS stack by the vertical interconnections, and can be replaced after each measurement.

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Type
research article
DOI
10.1049/el.2011.2683
Web of Science ID

WOS:000298373000009

Author(s)
Temiz, Yuksel  
•
Kilchenmann, Samuel  
•
Leblebici, Yusuf  
•
Guiducci, Carlotta  
Date Issued

2011

Publisher

Institution of Engineering and Technology

Published in
Electronics Letters- IEE
Volume

47

Start page

22

End page

24

Subjects

Dna-Hybridization

Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
CLSE  
LSM  
Available on Infoscience
February 28, 2012
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/78121
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