Modeling Surface Recombination with Enhanced Devices Network for Optoelectronics
We present a lumped devices network approach to simulate surface recombination effects in optoelectronics devices. The network is composed of generalized lumped devices where the excess carrier concentrations and gradients are mapped on electrical quantities, i.e. equivalent voltages and currents respectively, so that the overall simulation is SPICE-compatible. A novel enhanced device is derived and used as an additional element to account for the influence of the surface in SPICE-like simulations. Thus, in addition to generation, propagation and collection that were included in a former work, recombination at the surface of the semiconductor can be taken into account with standard circuit simulators. Optoelectronic devices performance degradation due to surface recombination is analyzed with this approach and compared with full numerical TCAD simulations.
WOS:000458806300009
2018-01-01
New York
978-1-5386-4859-9
IEEE International New Circuits and Systems Conference
35
39
REVIEWED
EPFL
Event name | Event place | Event date |
Montreal, CANADA | Jun 24-27, 2018 | |