Publication: Thermal Design of a Medium Voltage Modular Multilevel Converter Cell
Thermal Design of a Medium Voltage Modular Multilevel Converter Cell
cris.lastimport.scopus | 2024-08-09T11:04:51Z | |
cris.legacyId | 305142 | |
cris.virtual.author-scopus | 16309394400 | |
cris.virtual.department | PEL | |
cris.virtual.parent-organization | IEM | |
cris.virtual.parent-organization | STI | |
cris.virtual.parent-organization | EPFL | |
cris.virtual.sciperId | 243438 | |
cris.virtual.sciperId | 341256 | |
cris.virtual.unitId | 12902 | |
cris.virtual.unitManager | Dujic, Drazen | |
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cris.virtualsource.parent-organization | aedc5d70-0c91-42df-b753-d3e9d02a2cbe | |
cris.virtualsource.parent-organization | aedc5d70-0c91-42df-b753-d3e9d02a2cbe | |
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cris.virtualsource.unitManager | aedc5d70-0c91-42df-b753-d3e9d02a2cbe | |
datacite.rights | openaccess | |
dc.contributor.author | Frei, Yanick Patrick | |
dc.contributor.author | Dujic, Drazen | |
dc.date.accessioned | 2023-09-12T21:37:08 | |
dc.date.available | 2023-09-12T21:37:08 | |
dc.date.created | 2023-09-12 | |
dc.date.issued | 2023 | |
dc.date.modified | 2025-01-24T06:58:28.284198Z | |
dc.description.abstract | This paper presents the cooling concept for a medium voltage modular multilevel converter cell. To optimize power density, the metallic enclosure is used to dissipate the heat generated by semiconductor losses, while maintaining maximum temperatures below desired levels. Design, simulation results, and several different prototypes are verified and validated experimentally for their performance. | |
dc.description.sponsorship | PEL | |
dc.identifier.doi | 10.23919/EPE23ECCEEurope58414.2023.10264448 | |
dc.identifier.isi | WOS:001098971401099 | |
dc.identifier.uri | ||
dc.publisher | New York | |
dc.publisher.place | IEEE | |
dc.relation | https://infoscience.epfl.ch/record/305142/files/2023_EPE_Frei.pdf | |
dc.relation.conference | The 25th Conference on Power Electronics and Applications, EPE ’23 ECCE Europe | |
dc.relation.isbn | 978-9-0758-1541-2 | |
dc.relation.ispartof | Power Electronics and Applications (EPE’23 ECCE-Europe), 2023 25th European Conference on. Proceedings | |
dc.subject | Modular Multilevel Converters (MMC) | |
dc.subject | Thermal design | |
dc.title | Thermal Design of a Medium Voltage Modular Multilevel Converter Cell | |
dc.type | text::conference output::conference proceedings::conference paper | |
dspace.entity.type | Publication | |
dspace.file.type | postprint | |
dspace.legacy.oai-identifier | oai:infoscience.epfl.ch:305142 | |
epfl.curator.email | ||
epfl.lastmodified.email | ||
epfl.legacy.itemtype | Conference Papers | |
epfl.legacy.submissionform | CONF | |
epfl.oai.currentset | OpenAIREv4 | |
epfl.oai.currentset | fulltext | |
epfl.oai.currentset | STI | |
epfl.oai.currentset | conf | |
epfl.peerreviewed | REVIEWED | |
epfl.writtenAt | EPFL | |
oaire.citation.conferenceDate | September, 04 – 08, 2023 | |
oaire.citation.conferencePlace | Aalborg, Denmark | |
oaire.licenseCondition | n/a | |
oaire.version |