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  4. Powder formation in SiH[sub 4]–H[sub 2] discharge in large area capacitively coupled reactors: A study of the combined effect of interelectrode distance and pressure
 
research article

Powder formation in SiH[sub 4]–H[sub 2] discharge in large area capacitively coupled reactors: A study of the combined effect of interelectrode distance and pressure

Strahm, B.  
•
Hollenstein, Ch.  
2010
Journal of Applied Physics

One of the main challenges for silicon thin film deposition for solar cell applications is to achieve high rate deposition in order to reduce the manufacturing costs. However, when silane and hydrogen are used as precursor gas in parallel plate plasma-enhanced chemical vapor deposition, high rate deposition is generally synonymous of powdery discharge. In this work, time- and space-resolved light scattering experiments are presented. These were performed in an industrial-type large area reactor with a variable interelectrode distance. Results show that with a standard 25 mm interelectrode distance, the fraction of silane transformed into powder can be as high as 50% and that reducing the interelectrode distance shifts to higher pressure the appearance of powder in the discharge. From a standard 25 mm interelectrode distance to a 10 mm narrow gap reactor, the threshold pressure was increased from 2 to 7 mbars. More generally, it is proposed that the onset of powder formation depends mainly on the product of the interelectrode distance and the gas residence time in the discharge.

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Type
research article
DOI
10.1063/1.3282802
Web of Science ID

WOS:000274180600016

Author(s)
Strahm, B.  
Hollenstein, Ch.  
Date Issued

2010

Publisher

American Institute of Physics

Published in
Journal of Applied Physics
Volume

107

Issue

2

Article Number

023302

Subjects

discharges (electric)

•

electrodes

•

elemental semiconductors

•

high-pressure effects

•

hydrogen

•

light scattering

•

plasma CVD

•

semiconductor thin films

•

silicon

•

silicon compounds

•

Microcrystalline Silicon

•

Silane Plasmas

•

Rf

•

Deposition

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

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SPC  
Available on Infoscience
April 15, 2011
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/66508
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