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  4. InAlN/GaN MOSHEMT With Self-Aligned Thermally Generated Oxide Recess
 
research article

InAlN/GaN MOSHEMT With Self-Aligned Thermally Generated Oxide Recess

Alomari, M.
•
Medjdoub, F.
•
Carlin, J.-F.  
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2009
Ieee Electron Device Letters

We report on lattice-matched InAlN/GaN MOSHEMTs with an oxide-filled recess, self-aligned to the gate prepared by thermal oxidation at 800 degrees C in oxygen atmosphere. The device delivered a maximum current density of 2.4 A/mm. Pulse measurements showed no apparent lag effects, indicating a high-quality native oxide. This was confirmed by monitoring the radio-frequency load lines in the time domain. The MOSHEMT yielded a power density of 6 W/mm at a drain voltage as low as 20 V and at 4 GHz, a power added efficiency of 32% and an f(t) and f(max) of 61 and 112 GHz, respectively, illustrating the capability of such MOSHEMT to operate at high frequencies.

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Type
research article
DOI
10.1109/LED.2009.2031659
Web of Science ID

WOS:000271151500005

Author(s)
Alomari, M.
Medjdoub, F.
Carlin, J.-F.  
Feltin, E.
Grandjean, N.  
Chuvilin, A.
Kaiser, U.
Gaquiere, C.
Kohn, E.
Date Issued

2009

Published in
Ieee Electron Device Letters
Volume

30

Start page

1131

End page

1133

Subjects

InAlN/GaN

•

Moshemt

•

thermal oxidation

•

Performance

•

Hemts

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

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November 30, 2010
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/59708
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