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conference paper

Simulating Mold Risks under Future Climate Conditions

Lihachev, Grigory
•
Riemensberger, Johann  
•
Weng, Wenle  
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January 1, 2021
2021 Conference On Lasers And Electro-Optics Europe & European Quantum Electronics Conference (Cleo/Europe-Eqec)
Conference on Lasers and Electro-Optics Europe / European Quantum Electronics Conference (CLEO/Europe-EQEC)

This research tests the potential susceptibility of a prevalent, residential, wall assembly to the risk of sustained mold-growth in predicted future climate conditions. Here, the authors demonstrate a methodology that combines hygrothermal and mold-growth simulation tools with future weather files. This paper also explores the sensitivity of the results to predicted weather conditions, using nine weather context simulations for one city and separating the effect of rainfall from other climatic factors. The results illustrate how future climates may provide adequate conditions for sustained mold-growth in a wall assembly where no such problem exists today. This study demonstrates the potentially widespread need for this type of analysis. Further, the method lays the groundwork for exploring building designs and material selection from the perspective of climate resilience.

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Type
conference paper
DOI
10.26868/25222708.2019.211130
Web of Science ID

WOS:000728078301075

Author(s)
Lihachev, Grigory
Riemensberger, Johann  
Weng, Wenle  
Liu, Junqiu  
Tian, Hao
Siddharth, Anat  
Wang, Rui Ning  
Snigirev, Viacheslav  
He, Jijun  
Bhave, Sunil A.
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Date Issued

2021-01-01

Publisher

IEEE

Publisher place

New York

Published in
2021 Conference On Lasers And Electro-Optics Europe & European Quantum Electronics Conference (Cleo/Europe-Eqec)
ISBN of the book

978-1-6654-1876-8

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
LPQM  
Event nameEvent placeEvent date
Conference on Lasers and Electro-Optics Europe / European Quantum Electronics Conference (CLEO/Europe-EQEC)

ELECTR NETWORK

Jun 21-25, 2021

Available on Infoscience
February 14, 2022
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/185367
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