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  4. Temperature Influence Investigation on Hall Effect Sensors Performance Using a Lumped Circuit Model
 
conference paper

Temperature Influence Investigation on Hall Effect Sensors Performance Using a Lumped Circuit Model

Paun, Maria-Alexandra  
•
Sallese, Jean-Michel  
•
Kayal, Maher  
2012
2012 Ieee Sensors Proceedings
11th IEEE Sensors Conference

In order to provide the information on their Hall voltage, sensitivity and drift with temperature, a new simpler lumped circuit model for the evaluation of various Hall Effect sensors has been developed. In this sense, the finite element model associated contains both geometrical parameters (dimensions of the cells) and physical parameters such as mobility, conductivity, Hall factor, carrier concentration and the temperature influence on them. Therefore, a scalable finite element model in Cadence, for integrating in circuit environment CMOS Hall Effect devices with different shapes and technologies and assessing their performance, has been also elaborated.

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Type
conference paper
DOI
10.1109/ICSENS.2012.6411328
Web of Science ID

WOS:000315671100096

Author(s)
Paun, Maria-Alexandra  
Sallese, Jean-Michel  
Kayal, Maher  
Date Issued

2012

Publisher

IEEE

Publisher place

New York

Published in
2012 Ieee Sensors Proceedings
ISBN of the book

978-1-4577-1766-6

Total of pages

4

Series title/Series vol.

IEEE Sensors

Start page

382

End page

385

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
GR-KA  
EDLAB  
Event name
11th IEEE Sensors Conference
Available on Infoscience
May 13, 2013
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/92207
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