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  4. Combining microstereolithography and thick resist UV lithography for 3D microfabrication
 
conference paper

Combining microstereolithography and thick resist UV lithography for 3D microfabrication

Bertsch, Arnaud  
•
Lorenz, Hubert
•
Renaud, Philippe  
1998
Proceedings of MEMS 98, IEEE Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems
11th Annual International Workshop on Micro Electro Mechanical Systems

A new approach for the realization Of true 3D polymer structures is presented in this paper. It consists in adding, in a post-processing microstereolithography step, 3D polymer microstructures on top of a micropart patterned by means of planar processes such as thin films, bulk silicon etching or high aspect ratio structuration (LIGA, RIE, thick resist). This way, some shape limitations of the planar technologies can be overcomed far the new functional applications. Moreover, the direct processing of microstereolithography on predefined structures prevents manipulations which are associated with microassembly of separated parts. To demonstrate this combination of microstructuration processes, an example showing a conical axle added by microstereolithography on a SU-8 piece of gearing is presented.

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Type
conference paper
DOI
10.1109/MEMSYS.1998.659722
Web of Science ID

WOS:000073380900004

Author(s)
Bertsch, Arnaud  
Lorenz, Hubert
Renaud, Philippe  
Date Issued

1998

Published in
Proceedings of MEMS 98, IEEE Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems
Start page

18

End page

23

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
LMIS4  
Event nameEvent placeEvent date
11th Annual International Workshop on Micro Electro Mechanical Systems

HEIDELBERG, GERMANY

JAN 25-29, 1998

Available on Infoscience
September 13, 2005
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/216120
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