A method for manufacturing a hybrid soft-rigid electromechanical device comprising the steps of i) placing electronic components on a temporary substrate; ii) encapsulating said electronic components within a soft curable material and curing said soft curable material, thereby embedding said electronic components into a cured soft material; iii) removing said temporary substrate, thereby exposing a levelled surface comprising a cured soft material and electronic components; iv) forming at least one conductive path on said exposed levelled surface, and in direct contact with at least one of said electronic components; and v) encapsulating the resulting structure within a soft curable material and curing said soft curable material, thereby embedding said at least one conductive path into a cured soft material.Hybrid soft-rigid electromechanical device obtainable by the said method are also disclosed.