Takabayashi, Alain Y.Sattari, HamedEdinger, PierreVerheyen, PeterGylfason, Kristinn B.Bogaerts, WimQuack, Niels2021-11-062021-11-062021-11-062021-01-0110.1109/TRANSDUCERS50396.2021.9495551https://infoscience.epfl.ch/handle/20.500.14299/182859WOS:000707041600121The integration of MEMS transducers in photonic integrated circuits provides opportunities for high efficiency photonic modulation and dynamic routing on-chip. We here present an electrostatically actuated, silicon photonic MEMS 2 x 2 power coupler, fabricated in IMEC's iSiPP50G platform followed by a dedicated MEMS release sequence. The in-plane, mechanical tuning mechanism provides analog power coupling between waveguides in a small form factor. With our experimental demonstration of broad, > 30 nm optical bandwidth, high extinction ratio of > 27 dB, and a low actuation voltage of only 6 V, the coupler fulfills the requirements for large-scale integration in next generation reconfigurable PICs.microelectromechanical systemsphotonic integrated circuitssilicon photonicsphotonicsoptical switchtext::conference output::conference proceedings::conference paper