3D Assembly Using Au-Si Eutectic and Au-Au Thermocompression Wafer Level Bonding for M(O)EMS Device Fabrication

Lani, SébastienCanonica, MichaelBayat, DaraAtaman, CaglarNoell, Wilfriedde Rooij, Nico2011-02-162011-02-162011-02-16201010.1149/1.3483492https://infoscience.epfl.ch/handle/20.500.14299/643633D Assembly Using Au-Si Eutectic and Au-Au Thermocompression Wafer Level Bonding for M(O)EMS Device Fabricationtext::journal::journal article::research article