Churaev, MikhailHoenl, SimonWang, Rui NingMoehl, CharlesLiu, TianyiSkehan, J. ConnorRiemensberger, JohannCaimi, DanieleLiu, JunqiuSeidler, PaulKippenberg, Tobias J.2021-03-262021-03-262021-03-262020-01-0110.1364/CLEO_SI.2020.STh1F.3https://infoscience.epfl.ch/handle/20.500.14299/176306WOS:000612090003214We demonstrate the integration of a Si3N4 Damascene photonic platform with thin-film lithium niobate on insulator (LNOI) via direct wafer bonding. This process enables fabrication of hybrid chi((2))-chi((3)) microresonators with Q similar to 10(6), as well as integrated travelling wave EO modulators. (c) 2020 The Author(s)Engineering, Electrical & ElectronicOpticsPhysics, AppliedEngineeringPhysicssilicontext::conference output::conference proceedings::conference paper