Pisani, M. B.Hibert, C.Bouvet, D.Beaud, P.Ionescu, A. M.2007-10-102007-10-102007-10-10200410.1016/j.mee.2004.03.020https://infoscience.epfl.ch/handle/20.500.14299/12750WOS:0002221454000845304Copper/polyimide fabrication process for above-IC integration of high quality factor inductorstext::journal::journal article::research article