Kippenberg, TobiasLi, Zihan2024-07-042024-07-042024-07-042024https://infoscience.epfl.ch/handle/20.500.14299/209201DUV photolithography compatible electrode fabrication method comprising providing at least one material surface to which at least one electrode is to be attached; providing at least one undercut non-photoresist material or support between the at least one material surface and a photoresist material or layer provided on the at least one undercut non-photoresist material or support; providing or depositing at least one electrode or lift-off material on the photoresist material or layer and on the at least one material surface to form at least a portion of the electrode; and removing or stripping the photoresist material or layer from the at least one undercut non-photoresist material or support to remove the at least one electrode or lift-off material from the at least one undercut non-photoresist material or support.patentWO202412722584519376