Rodrigo, AyalaLuis, JoséSridhar, ArvindCuesta, David2010-07-262010-07-262010-07-26201010.1016/j.vlsi.2010.06.002https://infoscience.epfl.ch/handle/20.500.14299/51865WOS:000281750100001As 3D chip multi-processors (3D-CMPs) become the main trend in processor development, various thermal management strategies have been recently proposed to optimize system performance while controlling the temperature of the system to stay below a threshold. These thermal-aware policies require the envision of high-level models that capture the complex thermal behavior of (nano)structures that build the 3D stack. Moreover, the floorplanning of the chip strongly determines the thermal profile of the system and a quick exploration of the design space is required to minimize the damage of the thermal effects.temperaturethermal modelfloorplanning3DNano-gridtext::journal::journal article::research article