Foil-to-foil Electrical Interconnection of Printed Capacitive Sensors Using Through Foil Vias and Anisotropic Conductive Adhesive Technologies

Quintero, VasquezFelipe, Andresvan Remoortere, BartMolina-Lopez, FranciscoSmits, Edsger C. P.van den Brand, JeroenBriand, DanickSchoo, Herman F. M.de Rooij, Nico2012-08-232012-08-232012-08-232012https://infoscience.epfl.ch/handle/20.500.14299/85016Foil-to-foil Electrical Interconnection of Printed Capacitive Sensors Using Through Foil Vias and Anisotropic Conductive Adhesive Technologiestext::conference output::conference proceedings::conference paper